The global wire bonding market is projected to grow to USD 7.82 billion by 2032, fueled by rising demand in the semiconductor industry, advanced packaging technologies, and the trend toward electronic miniaturization. Wire bonding remains a critical interconnection method in IC manufacturing, enabling high reliability and precision in compact designs. As smartphones, IoT devices, and ... https://www.openpr.com/news/4099662/connecting-the-future-wire-bonding-market-to-reach-usd-7-82